Rogers RO4003C 5.05mm 8-Layer PCB with ENIG Finish for High-Frequency Multilayer Applications
1.Introduction to Core Technologies
RO4003C is a high-performance hydrocarbon ceramic laminate developed by Rogers Corporation, specifically designed for RF and microwave applications. It offers a unique combination of low loss, stable electrical properties, and standard epoxy/FR-4 fabrication processes. Unlike traditional PTFE-based materials, RO4003C does not require specialized plasma treatment or sodium etch for through-hole preparation, making it cost-effective and manufacturing-friendly. The material features a glass transition temperature above 280°C and exceptional thermal reliability, making it suitable for multilayer constructions with lead-free assembly processes.
2.RO4003C Key Features and Benefits
Stable Dk 3.38 ± 0.05 at 10 GHz ensures consistent impedance control across frequency and temperature
Low Df 0.0027 at 10 GHz minimizes signal loss for high-frequency circuits
Tg >280°C and Td 425°C provide excellent thermal reliability for lead-free assembly
CTE 14-16 ppm/°C (X/Y) matches copper for superior dimensional stability in multilayer designs
Moisture absorption only 0.06% maintains electrical performance in humid environments
UL 94 V-0 rated for safety compliance
Compatible with standard epoxy/FR-4 fabrication eliminates need for plasma treatment, reducing manufacturing cost
Cost-effective alternative to PTFE materials enables high-volume commercial applications
Proven reliability in wireless communications, automotive radar, and aerospace systems
3. RO4003C Multilayer Processing Guidelines
Based on Rogers' fabrication guidelines for RO4000 series laminates, the following key processing considerations apply to this 8-layer construction:
Inner Layer Preparation:
RO4003C cores are compatible with both pinned and pinless tooling systems. Slotted pins and multiline tooling formats are recommended for optimal registration.
Copper surfaces can be prepared using chemical or mechanical processes. Thinner cores should use chemical cleaning with micro-etching, while thicker cores (like the 1.524mm and 0.762mm used here) are compatible with mechanical scrub systems.
RO4003C works with standard liquid and dry film photoresists and can be processed through standard develop, etch, and strip (DES) systems.
Copper oxide or oxide alternative treatments are recommended for multilayer bonding preparation.
Multilayer Bonding:
RO4003C cores bond effectively with RO4450F prepreg using standard thermoset adhesive bonding cycles.
The bond cycle parameters should follow RO4400 series bondply guidelines.
Drilling Recommendations:
Surface speed: 300-500 SFM (avoid exceeding 500 SFM)
Chip load: 0.002"-0.004"/rev for mid-range and large tools; lower for small diameter drills
Standard carbide tools are preferred over undercut styles
Expected tool life: 2,000-3,000 hits
Standard entry (aluminum) and exit (phenolic) materials can be used
PTH Processing:
Desmear is typically not required for double-sided boards due to high Tg (>280°C)
Multilayer boards may require alkaline permanganate or CF4/O2 plasma desmear depending on prepreg layers
Etchback of RO4003C layers is not recommended as it may loosen filler particles
Material is compatible with standard electroless copper and direct metallization processes
Outer Layer Processing:
Compatible with standard acid copper plating and electrolytic tin/tin-lead
Can be processed through standard strip/etch/strip (SES) processes
Post-etch surface bonds well with solder masks
Final Finishes:
Compatible with OSP, HASL, and most chemically deposited or electroplated finishes including ENIG
Routing:
Use carbide multi-luted spiral or diamond cut router bits
Surface speed below 500 SFM recommended
Chip load: 0.0010-0.0015"/rev
Copper should be etched away from routing path to prevent burring
4.RO4003C Data Sheet Summary
| Property | Conditions | Typical Value | Unit | Test Method |
|---|---|---|---|---|
| Dielectric Constant (Dk) | @ 10 GHz | 3.38 ± 0.05 | - | IPC-TM-650 2.5.5.5 |
| Dissipation Factor (Df) | @ 10 GHz | 0.0027 | - | IPC-TM-650 2.5.5.5 |
| Thermal Conductivity | 80°C | 0.71 | W/m·K | ASTM D5470 |
| Tg (Glass Transition) | DMA | >280 | °C | IPC-TM-650 2.4.24 |
| Td (Decomposition Temp) | 5% weight loss | 425 | °C | IPC-TM-650 2.4.24.6 |
| CTE - X/Y axis | -55 to 288°C | 14-16 | ppm/°C | IPC-TM-650 2.4.41 |
| CTE - Z axis | -55 to 288°C | 46 | ppm/°C | IPC-TM-650 2.4.41 |
| Volume Resistivity | C96/35/90 | 1.7 x 10¹⁰ | MΩ-cm | IPC-TM-650 2.5.17.1 |
| Surface Resistivity | C96/35/90 | 4.2 x 10⁹ | MΩ | IPC-TM-650 2.5.17.1 |
| Flexural Strength | LW/CW | 276/213 | MPa | IPC-TM-650 2.4.4 |
| Copper Peel Strength | 1 oz after solder | 1.05 | N/mm | IPC-TM-650 2.4.8 |
| Moisture Absorption | D48/50 | 0.06 | % | IPC-TM-650 2.6.2.1 |
| Flammability Rating | UL94 | V-0 | - | UL 94 |
5.PCB Specifications
| Item | Specification |
|---|---|
| Product Type | 8-Layer High-Frequency Multilayer PCB |
| Core Material | Rogers RO4003C (4 sheets) |
| Core Thicknesses | 1.524mm / 1.524mm / 0.762mm / 0.762mm |
| Prepreg Material | Rogers RO4450F |
| Layer Count | 8 Layers |
| Outer Layer Copper | 1oz (approx. 35μm) |
| Inner Layer Copper | 0.5oz (approx. 18μm) |
| Finished Thickness | 5.05mm |
| Surface Finish | ENIG (Electroless Nickel Immersion Gold) |
| Solder Mask | Green (Top: no silkscreen, Bottom: white silkscreen) |
| Dimensions | 91mm x 77mm = 1 PCS |
6.PCB Stackup (8-Layer Rigid Structure)
L1 (Top): 1oz Copper (Green solder mask, no silkscreen)
Core 1: RO4003C, 1.524mm
L2: 0.5oz Copper
Prepreg: RO4450F layers
L3: 0.5oz Copper
Core 2: RO4003C, 1.524mm
L4: 0.5oz Copper
Prepreg: RO4450F layers
L5: 0.5oz CopperB
Core 3: RO4003C, 0.762mm
L6: 0.5oz Copper
Prepreg: RO4450F layers
L7: 0.5oz Copper
Core 4: RO4003C, 0.762mm
L8 (Bottom): 1oz Copper (Green solder mask, white silkscreen)
7.Typical Applications
Wireless Communications: Base stations, antennas, power amplifiers
Automotive Radar: 77GHz ADAS sensors
Aerospace & Defense: Radar systems, avionics, satellite communications
Test & Measurement: RF test equipment, network analyzers
Broadband Systems: Microwave backhaul, satellite terminals
Industrial IoT: High-frequency wireless modules and sensors
8.Quality Assurance
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide
